Semiconductors-全方位精密蚀刻解决方案与服务

Semiconductors

Wafer manufacturing and advanced packaging are the core driving forces for the continuous evolution of the semiconductor industry, and etching technology is the precise engraving tool that enables this process. Our solutions focus on providing ultimate precision at the nanometer to micrometer level and excellent uniformity control, covering key processes such as dry etching and wet etching.

In the previous wafer manufacturing process, our technology was used to precisely etch the microscopic patterns of transistors and interconnection lines, which were crucial for the formation of advanced architectures such as FinFET and GAA; in the advanced packaging field, we provided high aspect ratio and high selectivity etching capabilities for processes like TSV (Silicon Through Hole), RDL (Re-bonding Layer), and micro bumps, helping to achieve higher interconnection density and better electrical performance.

High-precision Etching System in Mass Production Practice in The Semiconductor Industry

This case demonstrates the successful application of our high-precision etching system in the advanced logic chip production line of a renowned semiconductor foundry. In the face of core challenges such as extremely narrow critical dimension control in FinFET structure etching, the morphology control of ultra-high aspect ratio contact holes, and the process compatibility across multiple technology nodes, our equipment, with its advanced plasma source control, real-time endpoint detection system, and cavity intelligent matching technology, has achieved breakthroughs in the uniformity, selectivity, and repeatability of the etching process. This solution successfully helped the customer achieve stable mass production at multiple technology nodes ranging from 65nm to 5nm, significantly improved the yield of the key layer process, and achieved lower total cost of ownership (CoO), providing a reliable manufacturing foundation for its continuous technological evolution.

Chemcut PCB Etching Machines for Fabrication of PCB

Throughout our history, we have used the concept of continuous improvement to ensure our etchers and other wet processing machines are designed and built to ensure their quality, reliability, and longevity. Our dedication to continuous improvement means we are always striving to outdo ourselves.

Along with thin material transport, we have improved our etch uniformity continuously. If you’re using a Huazhou etcher, you are able to etch 2 mil line and space with no issue.

If you desire to etch a line and space smaller than 2 mils, thinner copper is required. The thinner the copper you etch the smaller the etched line and space can be.

Need even better uniformity?

Huazhou has you covered with our patented Intermittent Spray and Etch Adjust Module.

The Intermittent Spray eliminates the puddling effect by giving extra etch to the middle of the panel, flattening the etch uniformity front to back.

Other Popular Options for the PCB Etching Process:

Specific gravity, ORP, and pH controls are all widely popular options in PCB etching. Some of the product lines Huazhou offers are detailed below:

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